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? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 1 overview kemet arcshield high voltage surface mount capacitors in x7r dielectric are designed for use in high voltage applications susceptible to surface arcing (arc-over discharge). the phenomenon of surface arcing is caused by a high voltage gradient between the two termination surfaces or between one of the termination surfaces and the counter internal electrode structure within the ceramic body. it occurs most frequently at application voltages that meet or exceed 300 v, in high humidity environments, and in chip sizes with minimal bandwidth separation (creepage distance). this phenomenon can either damage surrounding components or lead to a breakdown of the dielectric material, ultimately resulting in a short-circuit condition (catastrophic failure mode). patented arcshield technology features kemet's highly reliable base metal dielectric system combined with a unique internal shield electrode structure that is designed to suppress an arc-over event while increasing available capacitance. developed on the principle of a partial faraday cage, this internal system offers unrivaled performance and reliability when compared to external surface coating technologies. for added reliability, kemet's flexible termination technology is an available option that provides superior fex performance over standard termination systems. this technology was developed to address fex cracks, which are the primary failure mode of mlccs and typically the result of excessive tensile and shear stresses produced during board fexure and thermal cycling. flexible termination technology inhibits the transfer of board stress to the rigid body of the mlcc, therefore mitigating fex cracks which can result in low ir or short circuit failures. kemets arcshield high voltage surface mount mlccs are available in automotive grade, which undergo stricter testing protocol and inspection criteria. whether under-hood or in-cabin, these devices are designed for mission and safety- critical automotive circuits or applications requiring proven, reliable performance in harsh environments. automotive grade devices meet the demanding automotive electronics council's aec-q200 qualifcation requirements. surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield? technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade) ordering information c 0603 w 392 k c r a c tu ceramic case size (l" x w") specifcation/ series capacitance code (pf) capacitance tolerance rated voltage (vdc) dielectric failure rate/ design termination finish 1 packaging/ grade (c-spec) 2 0603 0805 1206 1210 1808 1812 1825 2220 2225 v = arcshield w = arcshield with flexible termination two signifcant 1 additional termination fnish options may be available. contact kemet for details. 1, 2 snpb termination fnish option is not available on automotive grade product. 2 additional reeling or packaging options may be available. contact kemet for details. one world. one kemet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 2 packaging c-spec ordering options table packaging type packaging/grade ordering code (c-spec) commercial grade 1 bulk bag not required (blank) 7" reel/unmarked tu 13" reel/unmarked 7411 (eia 0603 and smaller case sizes) 7210 (eia 0805 and larger case sizes) 7" reel/marked tm 13" reel/marked 7040 (eia 0603 and smaller case sizes) 7215 (eia 0805 and larger case sizes) 7" reel/unmarked/2 mm pitch 2 1 default packaging is "bulk bag". an ordering code c-spec is not required for "bulk bag" packaging. 1 the terms "marked" and "unmarked" pertain to laser marking option of capacitors. all packaging options labeled as "unmarked" will contain capacitors that have not been laser marked. 2 the 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. this option is limited to eia 0603 (1608 metric) case size devices. for more information regarding 2 mm pitch option see "tape & reel packaging information". 3 reeling tape options (paper or plastic) are dependent on capacitor case size (l" x w") and thickness dimension. see "chip thickness/tape & reel packaging quantities" and "tape & reel packaging information". 3 for additional information regarding "auto" c-spec options, see "automotive c-spec information". 3 all automotive packaging c-specs listed exclude the option to laser mark components. please contact kemet if you require a laser marked option. for more information see "capacitor marking". benefts ? p atented technology ? p ermanent internal arc protection ? p rotective surface coating not required ? b ase metal electrode (bme) dielectric system ? i ndustry leading cv values ? ? 55c to +125c operating temperature range ? e xceptional performance at high frequencies ? l ead (pb)-free, rohs and reach compliant ? e ia 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, and 2225 case sizes ? d c voltage ratings of 500 v, 630 v and 1 kv ? c apacitance offerings ranging from 1,000 pf to 560 nf ? a vailable capacitance tolerances of 5%, 10% and 20% ? l ow esr and esl ? n on-polar device, minimizing installation concerns ? c ommercial & automotive (aec-q200) grades available ? 1 00% pure matte tin-plated termination fnish allowing for excellent solderability ? s npb plated termination fnish option available upon request (5% pb minimum) ? f lexible termination option available upon request surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 3 automotive c-spec information kemet automotive grade products meet or exceed the requirements outlined by the automotive electronics council. details regarding test methods and conditions are referenced in document aecCq200, stress test qualif cation for passive components. these products are supported by a product change notif cation (pcn) and production part approval process warrant (ppap). automotive products offered through our distribution channel have been assigned an inclusive ordering code c-spec, auto. this c-spec was developed in order to better serve small and medium sized companies that prefer an automotive grade component without the requirement to submit a customer source controlled drawing (scd) or specif cation for review by a kemet engineering specialist. this c-spec is therefore not intended for use by kemets oem automotive customers and are not granted the same privileges as other automotive c-specs. customer pcn approval and ppap request levels are limited (see details below). product change notif cation (pcn) the kemet product change notif cation system is used to communicate primarily the following types of changes: ? product/process changes that affect product form, f t, function, and/or reliability ? changes in manufacturing site ? product obsolescence kemet automotive c-spec customer notif cation due to: days prior to implementation process/product change obsolescence* kemet assigned 1 yes (with approval and sign off) yes 180 days minimum auto yes (without approval) yes 90 days minimum 1 kemet assigned c-specs require the submittal of a customer scd or customer specif cation for review. for additional information contact kemet. production part approval process (ppap) the purpose of the production part approval process is: ? to ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. ? to provide the evidence that all customer engineering design record and specif cation requirements are properly understood and fulf lled by the manufacturing organization. ? to demonstrate that the established manufacturing process has the potential to produce the part kemet automotive c-spec ppap (product part approval process) level 1 2 3 4 5 kemet assigned 1 auto 1 kemet assigned c-specs require the submittal of a customer scd or customer specif cation for review. for additional information contact kemet. part number specif c ppap available product family ppap only surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 4 applications typical applications include switch mode power supplies (input flters, resonators, tank circuits, snubber circuits, output flters), high voltage coupling and dc blocking, lighting ballasts, voltage multiplier circuits, dc/dc converters and coupling capacitors in ?uk converters. markets include power supply, lcd fuorescent backlight ballasts, hid lighting, telecom equipment, industrial and medical equipment/control, lan/wan interface, analog and digital modems, and automotive (electric and hybrid vehicles, charging stations and lighting) applications. application notes x7r dielectric is not recommended for ac line fltering or pulse applications. qualifcation/certifcation commercial grade products are subject to internal qualifcation. details regarding test methods and conditions are referenced in table 4, performance & reliability. automotive grade products meet or exceed the requirements outlined by the automotive electronics council. details regarding test methods and conditions are referenced in document aecCq200, stress test qualifcation for passive components. for additional information regarding the automotive electronics council and aecCq200, please visit their website at www.aecouncil.com. environmental compliance lead (pb)-free, rohs, and reach compliant without exemptions (excluding snpb termination fnish option). surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 5 dimensions C millimeters (inches) C standard termination l b w s t eia size code metric size code l length w width t thickness b bandwidth s separation minimum mounting technique 0603 1608 1.60 (0.063) 0.15 (0.006) 0.80 (0.032) 0.15 (0.006) see table 2 for thickness 0.35 (0.014) 0.15 (0.006) 0.70 (0.028) solder wave or solder refow 0805 2012 2.00 (0.079) 0.20 (0.008) 1.25 (0.049) 0.20 (0.008) 0.50 (0.02) 0.25 (0.010) 0.75 (0.030) 1206 3216 3.20 (0.126) 0.20 (0.008) 1.60 (0.063) 0.20 (0.008) 0.50 (0.02) 0.25 (0.010) n/a 1210 3225 3.20 (0.126) 0.20 (0.008) 2.50 (0.098) 0.20 (0.008) 0.50 (0.02) 0.25 (0.010) solder refow only 1808 4520 4.70 (0.185) 0.50 (0.020) 2.00 (0.079) 0.20 (0.008) 0.60 (0.024) 0.35 (0.014) 1812 4532 4.50 (0.177) 0.30 (0.012) 3.20 (0.126) 0.30 (0.012) 0.60 (0.024) 0.35 (0.014) 1825 4564 4.50 (0.177) 0.30 (0.012) 6.40 (0.252) 0.40 (0.016) 0.60 (0.024) 0.35 (0.014) 2220 5650 5.70 (0.224) 0.40 (0.016) 5.00 (0.197) 0.40 (0.016) 0.60 (0.024) 0.35 (0.014) 2225 5664 5.60 (0.220) 0.40 (0.016) 6.40 (0.248) 0.40 (0.016) 0.60 (0.024) 0.35 (0.014) dimensions C millimeters (inches) C flexible termination eia size code metric size code l length w width t thickness b bandwidth s separation minimum mounting technique 0603 1608 1.60 (0.064) 0.17 (0.007) 0.80 (0.032) 0.15 (0.006) see table 2 for thickness 0.45 (0.018) 0.15 (0.006) 0.58 (0.023) solder wave or solder refow 0805 2012 2.00 (0.079) 0.30 (0.012) 1.25 (0.049) 0.30 (0.012) 0.50 (0.02) 0.25 (0.010) 0.75 (0.030) 1206 3216 3.30 (0.130) 0.40 (0.016) 1.60 (0.063) 0.35 (0.013) 0.60 (0.024) 0.25 (0.010) n/a 1210 3225 3.30 (0.130) 0.40 (0.016) 2.60 (0.102) 0.30 (0.012) 0.60 (0.024) 0.25 (0.010) solder refow only 1808 4520 4.70 (0.185) 0.50 (0.020) 2.00 (0.079) 0.20 (0.008) 0.70 (0.028) 0.35 (0.014) 1812 4532 4.50 (0.178) 0.40 (0.016) 3.20 (0.126) 0.30 (0.012) 0.70 (0.028) 0.35 (0.014) 1825 4564 4.60 (0.181) 0.40 (0.016) 6.40 (0.252) 0.40 (0.016) 0.70 (0.028) 0.35 (0.014) 2220 5650 5.90 (0.232) 0.75 (0.030) 5.00 (0.197) 0.40 (0.016) 0.70 (0.028) 0.35 (0.014) 2225 5664 5.90 (0.232) 0.75 (0.030) 6.40 (0.248) 0.40 (0.016) 0.70 (0.028) 0.35 (0.014) surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 6 electrical parameters/characteristics item parameters/characteristics operating temperature range ?55c to +125c capacitance change with reference to +25c and 0 vdc applied (tcc) 15% 1 aging rate (maximum % capacitance loss/decade hour) 3.0% 2 dielectric withstanding voltage (dwv) 150% of rated voltage for voltage rating of < 1000v 120% of rated voltage for voltage rating of 1000v (51 seconds and charge/discharge not exceeding 50ma) 3 dissipation factor (df) maximum limit at 25c insulation resistance (ir) minimum limit at 25c 100 megohm microfarads or 10g ('ettpmihjsvrwigsrhwexq' 1 regarding aging rate: capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. 2 dwv is the voltage a capacitor can withstand (survive) for a short period of time. it exceeds the nominal and continuous working voltage of the capacitor. 3 capacitance and dissipation factor (df) measured under the following conditions: 1 khz 50hz and 1.0 0.2 vrms if capacitance 10f 1 20hz 10hz and 0.5 0.1 vrms if capacitance >10f 4 to obtain ir limit, divide m-f value by the capacitance and compare to g limit. select the lower of the two limits. note: when measuring capacitance it is important to ensure the set voltage level is held constant. the hp4284 & agilent e4980 have a feature known as automatic level control (alc). the alc feature should be switched to "on". post environmental limits high temperature life, biased humidity, moisture resistance dielectric rated dc voltage capacitance value dissipation factor (maximum %) capacitance shift insulation resistance x7r > 25 all 3.0 20% 10% of initial limit 16/25 5.0 < 16 7.5 surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 7 table 1 C capacitance range/selection waterfall (0603 C 1812 case sizes) cap cap code case size/ series c0603w/v c0805w/v c1206w/v c1210w/v c1808w/v c1812w/v c1825w/v c2220w/v c2225w/v voltage code c b d c b d c b d c b d c b d c b d c b c b c b rated voltage (vdc) 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 500 630 500 630 capacitance tolerance product availability and chip thickness codes see table 2 for chip thickness dimensions 1,000 pf 102 j k m cg cg cg 1,200 pf 122 j k m cg cg 1,500 pf 152 j k m cg cg 1,800 pf 182 j k m cg 2,200 pf 222 j k m cg dg dg dg 2,700 pf 272 j k m cg dg dg dg 3,300 pf 332 j k m cg dg dg dg 3,900 pf 392 j k m cg dg dg dg 4,700 pf 472 j k m dg dg dg 5,600 pf 562 j k m dg dg 6,800 pf 682 j k m dg dg 8,200 pf 822 j k m dg dg 10,000 pf 103 j k m dg dg 12,000 pf 123 j k m dg dg ej ej ej 15,000 pf 153 j k m dg ej ej ej 18,000 pf 183 j k m dg ej ej ej le le le 22,000 pf 223 j k m dg ej ej ej fz fz fz le le le 27,000 pf 273 j k m ej ej fz fz fz la la la gb gb gb 33,000 pf 333 j k m ej ej fz fz fu la la la gb gb gb 39,000 pf 393 j k m ej fz fz fu la la la gb gb gb 47,000 pf 473 j k m ej fz fu fk la la lb gb gb gc 56,000 pf 563 j k m ej fz fu fk la la lb gb gb ge 62,000 pf 623 j k m ej fz fk fs la la lc gb gb ge 68,000 pf 683 j k m ej fz fk fs la la lc ge ge ge 82,000 pf 823 j k m fu fk la lc gb ge gk 0.10 f 104 j k m fk fs la lc gb gh gj 0.12 f 124 j k m fk la ge gk he he 0.15 f 154 j k m fk lb ge gn he he je je 0.18 f 184 j k m gf he hg je je kf ke 0.22 f 224 j k m gj he hj jk jk ke kf 0.27 f 274 j k m gl hj hj jk jl kf kh 0.33 f 334 j k m gs hj jl jn kf kh 0.39 f 394 j k m hk jn kh kj 0.47 f 474 j k m jn kh kj 0.56 f 564 j k m kj cap cap code rated voltage (vdc) 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 1000 500 630 500 630 500 630 voltage code c b d c b d c b d c b d c b d c b d c b c b c b case size/ series c0603w/v c0805w/v c1206w/v c1210w/v c1808w/v c1812w/v c1825w/v c2220w/v c2225w/v these products are protected under us patents 8,885,319 b2 and 9,490,072 b2, other patents pending, and any foreign counterparts. kemet reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within the same form factor (confguration and dimensions). surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 8 table 2a C chip thickness/tape & reel packaging quantities thickness code case size 1 thickness range (mm) paper quantity 1 plastic quantity 7" reel 13" reel 7" reel 13" reel cg 0603 0.80 0.10 4,000 15,000 0 0 dg 0805 1.25 0.15 0 0 2,500 10,000 ej 1206 1.70 0.20 0 0 2,000 8,000 fz 1210 1.25 0.20 0 0 2,500 10,000 fu 1210 1.55 0.20 0 0 2,000 8,000 fk 1210 2.10 0.20 0 0 2,000 8,000 fs 1210 2.50 0.30 0 0 1,000 4,000 le 1808 1.00 0.10 0 0 2,500 10,000 la 1808 1.40 0.15 0 0 1,000 4,000 lb 1808 1.60 0.15 0 0 1,000 4,000 lc 1808 2.00 0.15 0 0 1,000 4,000 gb 1812 1.00 0.10 0 0 1,000 4,000 ge 1812 1.30 0.10 0 0 1,000 4,000 gc 1812 1.10 0.10 0 0 1,000 4,000 gh 1812 1.40 0.15 0 0 1,000 4,000 gf 1812 1.50 0.10 0 0 1,000 4,000 gk 1812 1.60 0.20 0 0 1,000 4,000 gj 1812 1.70 0.15 0 0 1,000 4,000 gn 1812 1.70 0.20 0 0 1,000 4,000 gl 1812 1.90 0.20 0 0 500 2,000 gs 1812 2.10 0.20 0 0 500 2,000 he 1825 1.40 0.15 0 0 1,000 4,000 hg 1825 1.60 0.20 0 0 1,000 4,000 hj 1825 2.00 0.20 0 0 500 2,000 hk 1825 2.50 0.20 0 0 500 2,000 je 2220 1.40 0.15 0 0 1,000 4,000 jk 2220 1.60 0.20 0 0 1,000 4,000 jl 2220 2.00 0.20 0 0 500 2,000 jn 2220 2.50 0.20 0 0 500 2,000 ke 2225 1.40 0.15 0 0 1,000 4,000 kf 2225 1.60 0.20 0 0 1,000 4,000 kh 2225 2.00 0.20 0 0 500 2,000 kj 2225 2.50 0.20 0 0 500 2,000 thickness code case size 1 thickness range (mm) 7" reel 13" reel 7" reel 13" reel paper quantity 1 plastic quantity package quantity based on fnished chip thickness specifcations. 1 if ordering using the 2 mm tape and reel pitch option, the packaging quantity outlined in the table above will be doubled. this option is limited to eia 0603 (1608 metric) case size devices. for more information regarding 2 mm pitch option see "tape & reel packaging information". surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 9 table 2b C bulk packaging quantities packaging type loose packaging bulk bag (default) packaging c-spec 1 n/a 2 case size packaging quantities (pieces/unit packaging) eia (in) metric (mm) minimum maximum 0402 1005 1 50,000 0603 1608 0805 2012 1206 3216 1210 3225 1808 4520 20,000 1812 4532 1825 4564 2220 5650 2225 5664 1 the "packaging c-spec" is a 4 to 8 digit code which identifes the packaging type and/or product grade. when ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. see "ordering information" section of this document for further details. commercial grade product ordered without a packaging c-spec will default to our standard "bulk bag" packaging. contact kemet if you require a bulk bag packaging option for automotive grade products. 2 a packaging c-spec (see note 1 above) is not required for "bulk bag" packaging (excluding anti-static bulk bag and automotive grade products). the 15th through 22nd character positions of the ordering code should be left blank. all product ordered without a packaging c-spec will default to our standard "bulk bag" packaging. surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 10 table 3a C land pattern design recommendations per ipcC7351 C standard termination eia size code metric size code density level a: maximum (most) land protrusion (mm) density level b: median (nominal) land protrusion (mm) density level c: minimum (least) land protrusion (mm) c y x v1 v2 c y x v1 v2 c y x v1 v2 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 1.50 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1808 4520 2.30 1.75 2.30 7.4 0 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00 density level a: for low-density product applications. recommended for wave solder applications and provides a wider process window for refow solder processes. kemet only recommends wave soldering of eia 0603, 0805 and 1206 case sizes. density level b: for products with a moderate level of component density. provides a robust solder attachment condition for refow solder processes. density level c: for high component density product applications. before adapting the minimum land pattern variations the user should perform qualifcation testing based on the conditions outlined in ipc standard 7351 (ipcC7351). image below based on density level b for an eia 1210 case size. y c c x x v1 v2 grid placement courtyard y surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 11 table 3b C land pattern design recommendations per ipcC7351 C flexible termination eia size code metric size code density level a: maximum (most) land protrusion (mm) density level b: median (nominal) land protrusion (mm) density level c: minimum (least) land protrusion (mm) c y x v1 v2 c y x v1 v2 c y x v1 v2 0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20 0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81 1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16 1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11 1808 4520 2.30 1.75 2.30 7.4 0 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 1825 4564 2.15 1.80 6.90 7.10 7.90 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.00 2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60 2225 5664 2.85 2.10 6.90 8.80 7.90 2.75 1.90 6.80 7.90 7.30 2.65 1.70 6.70 7.20 7.00 density level a: for low-density product applications. recommended for wave solder applications and provides a wider process window for refow solder processes. kemet only recommends wave soldering of eia 0603, 0805 and 1206 case sizes. density level b: for products with a moderate level of component density. provides a robust solder attachment condition for refow solder processes. density level c: for high component density product applications. before adapting the minimum land pattern variations the user should perform qualifcation testing based on the conditions outlined in ipc standard 7351 (ipcC7351). image below based on density level b for an eia 1210 case size. y c c x x v1 v2 grid placement courtyard y surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 12 soldering process recommended soldering technique: ? s older wave or solder refow for eia case sizes 0603, 0805 and 1206 ? a ll other eia case sizes are limited to solder refow only recommended refow soldering profle: kemets families of surface mount multilayer ceramic capacitors (smd mlccs) are compatible with wave (single or dual), convection, ir or vapor phase refow techniques. preheating of these components is recommended to avoid extreme thermal stress. kemets recommended profle conditions for convection and ir refow refect the profle conditions of the ipc/j- std-020 standard for moisture sensitivity testing. these devices can safely withstand a maximum of three refow passes at these conditions. profle feature termination finish snpb 100% matte sn preheat/soak temperature minimum (t smin ) 100c 150c 150c 200c time (t s ) from t smin to t smax 60 C 120 seconds 60 C 120 seconds ramp-up rate (t l to t p ) 3c/second maximum 3c/second maximum liquidous temperature (t l ) 183c 217c time above liquidous (t l ) 60 C 150 seconds 60 C 150 seconds peak temperature (t p ) 235c 260c time within 5c of maximum peak temperature (t p ) 20 seconds maximum 30 seconds maximum ramp-down rate (t p to t l ) 6c/second maximum 6c/second maximum time 25c to peak temperature 6 minutes maximum 8 minutes maximum note 1: all temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly refow. time te mp erature t smin 25 t smax t l t p maximum ramp up rate = 3oc/sec maximum ramp down rate = 6oc/sec t p t l t s 25oc to peak surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 13 table 4 C performance & reliability: test methods and conditions stress reference test or inspection method terminal strength jisCcC6429 appendix 1, note: force of 1.8 kg for 60 seconds. board flex jisCcC6429 appendix 2, note: standard termination system C 2.0 mm (minimum) for all except 3 mm magnifcation 50 x. conditions: a) method b, 4 hours at 155c, dry heat at 235c b) method b at 215c category 3 c) method d, category 3 at 260c temperature cycling jesd22 method jaC104 1,000 cycles (?55c to +125c). measurement at 24 hours +/?4 hours after test conclusion. biased humidity milCstdC202 method 103 load humidity: 1,000 hours 85c/85% rh and 200 vdc maximum. add 100 k ohm resistor. measurement at 24 hours +/?4 hours after test conclusion. low volt humidity: 1,000 hours 85c/85% rh and 1.5 v. add 100 k ohm resistor. measurement at 24 hours +/?4 hours after test conclusion. moisture resistance milCstdC202 method 106 t = 24 hours/cycle. steps 7a and 7b not required. unpowered. measurement at 24 hours +/?4 hours after test conclusion. thermal shock milCstdC202 method 107 ? 55c/+125c. note: number of cycles required C 300. maximum transfer time C 20 1,000 hours at 125c (85c for x5r, z5u and y5v) with 1.2 x rated voltage applied. storage life milCstdC202 method 108 150c, 0 vdc for 1,000 hours. vibration milCstdC202 method 204 5 g's for 20 min., 12 cycles each of 3 orientations. note: use 8" x 5" pcb 0.031" thick 7 storage & handling ceramic chip capacitors should be stored in normal working environments. while the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. in addition, packaging materials will be degraded by high temperatureCreels may soften or warp and tape peel force may increase. kemet recommends that maximum storage temperature not exceed 40oc and maximum storage humidity not exceed 70% relative humidity. temperature fuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. for optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 14 construction C standard termination dielectric material (batio 3 ) detailed cross section barrier layer (ni) barrier layer (ni) end termination/ external electrode (cu) termination finish (100% matte sn/ snpb - 5% pb min) termination finish (100% matte sn/ snpb - 5% pb min) inner electrodes (ni) inner electrodes (ni) dielectric material (batio 3 ) shield electrodes (ni) shield electrodes (ni) shield electrode (ni) end termination/ external electrode (cu) construction C flexible termination dielectric material (batio 3 ) detailed cross section barrier layer (ni) inner electrodes (ni) barrier layer (ni) termination finish (100% matte sn/ snpb - 5% pb min) termination finish (100% matte sn/ snpb - 5% pb min) inner electrodes (ni) dielectric material (batio 3 ) epoxy layer (ag) epoxy layer (ag) shield electrodes (ni) shield electrodes (ni) shield electrode (ni) end termination/ external electrode (cu) end termination/ external electrode (cu) surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 15 capacitor marking (optional): these surface mount multilayer ceramic capacitors are normally supplied unmarked. if required, they can be marked as an extra cost option. marking is available on most kemet devices but must be requested using the correct ordering code identif er(s). if this option is requested, two sides of the ceramic body will be laser marked with a k to identify kemet, followed by two characters (per eiaC198 - see table below) to identify the capacitance value. eia 0603 case size devices are limited to the k character only. laser marking option is not available on: ? c0g, ultra stable x8r and y5v dielectric devices ? eia 0402 case size devices ? eia 0603 case size devices with flexible termination option. ? kps commercial and automotive grade stacked devices. ? x7r dielectric products in capacitance values outlined below marking appears in legible contrast. illustrated below is an example of an mlcc with laser marking of ka8, which designates a kemet device with rated capacitance of 100 f. orientation of marking is vendor optional. eia case size metric size code capacitance 0603 1608 170 pf 0805 2012 150 pf 1206 3216 910 pf 1210 3225 2,000 pf 1808 4520 3,900 pf 1812 4532 6,700 pf 1825 4564 0.018 f 2220 5650 0.027 f 2225 5664 0.033 f kemet id 2-digit capacitance code surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 16 capacitor marking (optional) contd capacitance (pf) for various alpha/numeral identif ers 9 0 1 2 3 4 5 6 7 8 capacitance (pf) a 0.1 1 0 10 100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000 b 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000 c 0.12 1 2 12 120 1,200 12,000 120,000 1,200,000 12,000,000 120,000,000 d 0.13 1 3 13 130 1,300 13,000 130,000 1,300,000 13,000,000 130,000,000 e 0.15 1 5 15 150 1,500 15,000 150,000 1,500,000 15,000,000 150,000,000 f 0.16 1 6 16 160 1,600 16,000 160,000 1,600,000 16,000,000 160,000,000 g 0.18 1 8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 h 0.2 2 0 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 j 0.22 2 2 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 k 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 l 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 m 0.3 3 0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 n 0.33 3 3 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 p 0.36 3 6 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 q 0.39 3 9 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 r 0.43 4 3 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 s 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 t 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 u 0.56 5 6 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 v 0.62 6 2 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 w 0.68 6 8 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 x 0.75 7 5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 y 0.82 8 2 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 2 5 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 3 5 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.4 4 0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 4 5 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.5 5 0 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.6 6 0 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.7 7 0 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.8 8 0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.9 9 0 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 17 tape & reel packaging information kemet offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with eia standard 481. this packaging system is compatible with all tape-fed automatic pick and place systems. see table 2 for details on reeling quantities for commercial chips. 8 mm, 12 mm or 16 mm carrier tape 178 mm (7.00") or 330 mm (13.00") anti-static reel embossed plastic* or punched paper carrier. embossment or punched cavity anti-static cover tape (.10 mm (.004") maximum thickness) chip and kps orientation in pocket (except 1825 commercial, and 1825 and 2225 militar y) *eia 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. kemet ? bar code label sprocket holes table 5 C carrier tape conf guration, embossed plastic & punched paper (mm) eia case size tape size (w)* embossed plastic punched paper 7" reel 13" reel 7" reel 13" reel pitch (p 1 )* pitch (p 1 )* 01005 C 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 C 1210 8 4 4 4 4 1805 C 1808 12 4 4 1812 12 8 8 kps 1210 12 8 8 kps 1812 & 2220 16 12 12 array 0508 & 0612 8 4 4 *refer to figures 1 & 2 for w and p 1 carrier tape reference locations. *refer to tables 6 & 7 for tolerance specif cations. new 2 mm pitch reel options* packaging ordering code (c-spec) packaging type/options c-3190 automotive grade 7" reel unmarked c-3191 automotive grade 13" reel unmarked c-7081 commercial grade 7" reel unmarked c-7082 commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 eia case size. 2 mm pitch reel for 0805 eia case size under development. benef ts of changing from 4 mm to 2 mm pitching spacing ? lower placement costs ? double the parts on each reel results in fewer reel changes and increased eff ciency ? fewer reels result in lower packaging, shipping and storage costs, reducing waste surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 18 figure 1 C embossed (plastic) carrier tape dimensions po t f w cent er line s of ca vity ao bo user direction of unre eling cover tape ko b 1 is for tape feeder reference only, including dra ft concentric abou t b o . t 2 ?d 1 ?do b 1 s 1 t 1 e 1 e 2 p 1 p 2 embossment for c avity size, see note 1 table 4 [10 pitches cumulative tolerance on tape 0.2 mm] table 6 ? embossed (plastic) carrier tape dimensions metric will govern constant dimensions millimeters (inches) tape size d 0 d 1 minimum note 1 e 1 p 0 p 2 r reference note 2 s 1 minimum note 3 t maximum t 1 maximum 8 mm 1.5 +0.10/-0.0 (0.059 +0.004/- 0.0) 1.0 (0.039) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 25.0 (0.984) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) 12 mm 1.5 (0.059) 30 (1.181) 16 mm variable dimensions millimeters (inches) tape size pitch b 1 maximum note 4 e 2 minimum f p 1 t 2 maximum w maximum a 0 ,b 0 & k 0 8 mm single (4 mm) 4.35 (0.171) 6.25 (0.246) 3.5 0.05 (0.138 0.002) 4.0 0.10 (0.157 0.004) 2.5 (0.098) 8.3 (0.327) note 5 12 mm single (4 mm) & double (8 mm) 8.2 (0.323) 10.25 (0.404) 5.5 0.05 (0.217 0.002) 8.0 0.10 (0.315 0.004) 4.6 (0.181) 12.3 (0.484) 16 mm triple (12 mm) 12.1 (0.476) 14.25 (0.561) 7.5 0.05 (0.138 0.002) 12.0 0.10 (0.157 0.004) 4.6 (0.181) 16.3 (0.642) 1. the embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. dimensions of embossment location and hole location shall be applied independent of each other. 2. the tape with or without components shall pass around r without damage (see figure 6). 3. if s 1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see eia standard 481 paragraph 4.3 section b). 4. b 1 dimension is a reference dimension for tape feeder clearance only. 5. the cavity def ned by a 0 , b 0 and k 0 shall surround the component with suff cient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see figure 4). (e) for kps series product, a 0 and b 0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see addendum in eia standard 481 for standards relating to more precise taping requirements. surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 19 figure 2 C punched (paper) carrier tape dimensions user direct ion of unr ee li ng top cover t ape t center li nes o f cavity p 1 ?do po e 1 f e 2 w g a 0 b 0 cavity size, see n ote 1, tab le 7 bottom cover tape t 1 t 1 bottom cover tape [10 pitc he s cumulative tolerance on tape 0.2 mm] table 7 ? punched (paper) carrier tape dimensions metric will govern constant dimensions millimeters (inches) tape size d 0 e 1 p 0 p 2 t 1 maximum g minimum r reference note 2 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.10 (0.004) maximum 0.75 (0.030) 25 (0.984) variable dimensions millimeters (inches) tape size pitch e2 minimum f p 1 t maximum w maximum a 0 b 0 8 mm half (2 mm) 6.25 (0.246) 3.5 0.05 (0.138 0.002) 2.0 0.05 (0.079 0.002) 1.1 (0.098) 8.3 (0.327) note 1 8 mm single (4 mm) 4.0 0.10 (0.157 0.004) 8.3 (0.327) 1. the cavity def ned by a 0 , b 0 and t shall surround the component with suff cient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20 maximum (see figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see figure 4). e) see addendum in eia standard 481 for standards relating to more precise taping requirements. 2. the tape with or without components shall pass around r without damage (see figure 6). surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 20 packaging information performance notes 1. cover tape break force: 1.0 kg minimum. 2. cover tape peel strength: the total peel strength of the cover tape from the carrier tape shall be: tape width peel strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) the direction of the pull shall be opposite the direction of the carrier tape travel. the pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. during peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. labeling: bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. refer to eia standards 556 and 624 . figure 3 C maximum component rotation ao bo t s max imum c ompon en t rota ti on t op view maxi mum co mponent rotat ion s id e view tape m ax imum width (mm) r otat io n ( t ) 8,12 20 16 ? 200 10 tap e m aximum wid th ( mm) ro tat ion ( s ) 8,12 20 16 ? 56 10 72 ? 200 5 typical pocke t center line typical com po nent centerline figure 4 C maximum lateral movement 0.5 mm maxi mum 0.5 mm maxi mum 8 mm & 1 2 mm tap e 1.0 mm maxi mum 1.0 mm maxi mum 1 6 mm tape figure 5 C bending radius r r b en ding radius e mbo sse d carrier p unc hed ca rrier surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 21 figure 6 C reel dimensions a d (see note) full radi us, see note b (see note) access hole at slot location (? 40 mm minimum) if present, tape slot in core for t ap e start: 2.5 mm minimum width x 10.0 mm minimum depth w3 (includes flange distortion at outer edge) w2 (m ea sured at hu b) w1 (m ea sured at hu b) c (arbor hole diameter) note: drive spokes optional; if used, dimensions b and d shall apply. n table 8 ? reel dimensions metric will govern constant dimensions millimeters (inches) tape size a b minimum c d minimum 8 mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm variable dimensions millimeters (inches) tape size n minimum w 1 w 2 maximum w 3 8 mm 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 22 figure 7 C tape leader & trailer dimensions trailer 16 0 mm minimum carrier t ape end start rou nd sp rock et holes el ongated spro ck et holes ( 32 mm tape and wi de r) t op co ve r t ape top c ove r t ape p unche d carrier 8 mm & 12 mm only e mboss ed carrier components 100 mm minimum leader 400 mm minimum figure 8 C maximum camber carrier tape round sprocket holes 1 mm ma ximum , either direction straight edge 250 mm elongated sprocket holes (32 mm & wider ta pe s) surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 ? 864-963-6300 ? www.kemet.com c 1034_x7r_hv_arc_smd ? 11/29/2016 23 kemet electronic corporation sales off ces for a complete list of our global sales off ces, please visit www.kemet.com/sales. disclaimer all product specif cations, statements, information and data (collectively, the information) in this datasheet are subject to change. the customer is responsible for checking and verifying the extent to which the information contained in this publication is applicable to an order at the time the order is placed. all information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. statements of suitability for certain applications are based on kemet electronics corporations (kemet) knowledge of typical operating conditions for such applications, but are not intended to constitute C and kemet specif cally disclaims C any warranty concerning suitability for a specif c customer application or use. the information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. any technical advice inferred from this information or otherwise provided by kemet with reference to the use of kemets products is given gratis, and kemet assumes no obligation or liability for the advice given or results obtained. although kemet designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. although all productCrelated warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. kemet is a registered trademark of kemet electronics corporation. surface mount multilayer ceramic chip capacitors (smd mlccs) arcshield technology, high voltage, x7r dielectric, 500 C 1,000 vdc (commercial & automotive grade)

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